High-Purity Single-Crystal Silicon Wafers – 1–12 Inch
Product Description
High-purity single-crystal silicon wafers are available in a wide
range of diameters, thicknesses, conductivity types, crystal
orientations and resistivity grades for semiconductor, thin-film,
spectroscopy, microscopy and materials research applications.
Both CZ (Czochralski) and FZ (Float Zone) single-crystal silicon
wafers are available. Options include P-type boron-doped silicon,
N-type phosphorus-, arsenic- or antimony-doped silicon, as well as
intrinsic FZ silicon.
Standard wafer thicknesses include 525 μm, 625 μm, 725 μm and
750 μm depending on wafer diameter. Custom substrate thicknesses
from approximately 50 μm to 12 mm can also be supplied.
Technical Parameters
| Material | High-Purity Single-Crystal Silicon |
| Wafer Size | 1–12 Inch |
| Surface Finish | Single-Side Polished |
| Crystal Growth Method | CZ (Czochralski) / FZ (Float Zone) |
| P-Type | Boron (B) Doped |
| N-Type | Phosphorus (P), Arsenic (As), Antimony (Sb) Doped |
| Intrinsic Silicon | Intrinsic FZ Silicon Available |
| Crystal Orientation | (100) / (110) / (111) |
| Custom Thickness Range | 50 μm – 12 mm |
Standard Wafer Thickness
| Wafer Diameter | Typical Thickness |
|---|---|
| Up to 4 Inch | 525 μm |
| 6 Inch | 625 μm |
| 8 Inch | 725 μm |
| 12 Inch | 750 μm |
Resistivity Options
| Grade | Resistivity Range |
|---|---|
| Low Resistivity | 0.0005–1 Ω·cm |
| Medium Resistivity | 1–100 Ω·cm |
| High Resistivity | 1,000–100,000 Ω·cm |
Geometry & Surface Quality
| TIR | < 3 μm |
| TTV | < 10 μm |
| BOW | < 10 μm |
| Surface Roughness | < 0.5 nm |
| Particle Count | < 10 particles for size > 0.3 μm |
Typical Stock Configuration
Example: 4-inch single-side polished P-type silicon wafer,
(100) crystal orientation, 525 μm thickness and
approximately 1–20 Ω·cm resistivity.
Other stock configurations are available.
Product Features
- High-purity single-crystal silicon
- CZ and FZ crystal growth options
- P-type, N-type and intrinsic FZ silicon available
- Low, medium and high resistivity grades
- (100), (110) and (111) crystal orientations
- Single-side polished surface
- Thicknesses from 50 μm to 12 mm available
- Low surface roughness and high wafer flatness
- Multiple stock specifications available
Applications
- PVD thin-film deposition substrates
- CVD thin-film deposition substrates
- Magnetron sputtering
- X-ray diffraction (XRD)
- Infrared spectroscopy
- Fluorescence spectroscopy
- SEM scanning electron microscopy
- AFM atomic force microscopy
- Ultra-flat laboratory substrates
- Molecular beam epitaxy (MBE)
- X-ray analysis
- Semiconductor and crystal research
Other Silicon Substrate Options
- Single-Crystal Silicon (Si) Wafers
- Silicon Dioxide (SiO₂) Wafers
- Silicon Nitride (SiN) Wafers
- Metal-Coated Silicon Wafers, including Au and Cu coatings
Customization
Multiple stock specifications are available. Wafer diameter,
thickness, conductivity type, dopant, crystal orientation and
resistivity can be selected according to customer requirements.
For quotation, please provide the required wafer diameter,
thickness, crystal orientation, conductivity type, dopant and
resistivity range.


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