IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
  1. IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
  2. IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
  3. IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
  4. IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research
  5. IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research

IW1 4-Inch SiO2 & SiC Wafers for Laser Cutting and RFID Research

Price range: $52.00 through $60.00

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4-Inch SiO₂ SiC Wafers for Laser Cutting and RFID Research

4-Inch SiO2 SiC Wafers for Laser Cutting and RFID Research

Custom Specifications

Thickness Various special thicknesses can be customized
Resistivity Various resistivity values can be customized
Crystal Orientation Customizable
Oxidation Single-side or double-side oxidation available
Substrate Customizable
Oxide Layer Thickness Various oxide layer thicknesses available

Custom Pricing

Pricing varies depending on thickness, resistivity, crystal orientation,
oxidation method, substrate and oxide layer thickness.
Please contact customer service to confirm pricing for custom specifications.

Cutting Service

Cutting services for oxidized wafers in various sizes are available.

Size

300 NM Oxide Layer Thickness, Other Specifications

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