Precision Stainless Steel Shadow Masks

Manufacturing Methods
The masks are mainly manufactured using high-precision chemical
etching or laser cutting and welding processes.
Process Specifications
| Process | Material / Thickness | Feature Size | Error | Notes |
|---|---|---|---|---|
| Chemical Etching | 304 Stainless Steel / 0.3 mm | 0.4 mm line width 0.4 mm opening |
30–60 µm | Relatively fast production and lower cost |
| High-Precision Chemical Etching | Stainless Steel | 0.1 mm (100 µm) line width | Solid area: 30 µm Opening area: 60 µm |
Suitable for interdigitated electrode mask patterns; relatively higher price |
| Ultra-High-Precision Laser Processing | Stainless Steel | 0.04 mm (40 µm) line width | 20 µm | High-precision process with higher cost |
Design Considerations
For high-precision chemical-etched interdigitated electrode masks,
the solid-area error is approximately 30 µm and the opening-area
error is approximately 60 µm. These errors should be considered
when designing the pattern structure.
Applications
The masks can be used in electron-beam evaporation, thermal
evaporation and magnetron sputtering equipment for preparing
patterned thin films and electrodes.
- OPV devices
- OLED devices
- Perovskite solar cells
- Photodetectors
- Field-effect transistors
- Patterned thin films and electrodes
Process Comparison
In general, masks manufactured by chemical etching have a smoother
surface and better flatness, but the price is relatively higher.
Masks manufactured by high-precision laser cutting and welding may
have a slightly rougher surface. They are normally polished and can
meet standard laboratory requirements. This type is suitable for
electrode evaporation in thermal evaporation coating equipment,
including mask designs with recessed grooves. Customers with special
requirements should specify them in advance.
Drawing Requirements
Please provide a CAD drawing whenever possible. If a CAD drawing
cannot be provided, please provide a sketch that accurately describes
the required mask specifications.














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