5 µm Precision Shadow Masks for IDEs, Microhole Arrays & Transistor Channels
Manufacturing Methods
Stainless steel shadow masks are mainly manufactured using
high-precision chemical etching or laser cutting and welding processes.
Process Specifications
| Process | Material / Thickness | Feature Size | Error | Notes |
|---|---|---|---|---|
| Chemical Etching | 304 Stainless Steel / 0.3 mm | 0.4 mm (400 µm) line width 0.4 mm (400 µm) opening |
30–60 µm | Fast processing and relatively low cost |
| High-Precision Chemical Etching | Stainless Steel | 0.1 mm (100 µm) line width | Solid area: 30 µm Opening area: 60 µm |
Suitable for interdigitated electrode shadow masks; pattern design should account for process error |
| Ultra-High-Precision Laser Processing | Stainless Steel | 0.04 mm (40 µm) line width | 20 µm | Higher precision and higher cost |
Design Considerations
For high-precision chemically etched interdigitated electrode masks,
the solid-area error is approximately 30 µm and the opening-area
error is approximately 60 µm. These tolerances should be considered
when designing the pattern structure.
Applications
Shadow masks can be used in electron-beam evaporation,
thermal evaporation and magnetron sputtering equipment
for patterned thin-film and electrode fabrication.
- OPV devices
- OLED devices
- Perovskite solar cells
- Photodetectors
- Field-effect transistors
- Patterned thin films
- Patterned electrodes
Process Notes
Chemically etched shadow masks generally have a smoother surface
and better flatness, but the price is relatively higher.
High-precision laser-cut and welded masks may have a slightly
rougher surface. They are generally polished and can meet normal
laboratory requirements. Customers with special requirements
should specify them in advance.
Drawing Requirements
Please provide a CAD drawing whenever possible.
If a CAD drawing cannot be provided, please provide a sketch
that accurately describes the required shadow mask specifications.
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