Alumina Ceramic Gold Interdigitated Electrode (IDE)
This interdigitated electrode is manufactured on an alumina ceramic
substrate with a multilayer Cu/Ni/Au electrode structure. It is designed
as a durable electrode platform for gas, humidity, temperature, thermal,
pressure and photosensitive sensor-development applications.
Key Features
- Alumina ceramic substrate
- Multilayer Cu/Ni/Au electrode structure
- Operating temperature range from −50°C to 350°C
- Suitable for different functional sensing-material coatings
- Can be cleaned and reused if the electrode remains undamaged
- Custom electrode dimensions and patterns are available
Product Specifications
| Product Type | Ceramic interdigitated electrode (IDE) |
| Substrate Material | Alumina ceramic (Al₂O₃) |
| Metal-Layer Structure | Copper / Nickel / Gold (Cu/Ni/Au) |
| Copper-Layer Thickness | 18 μm ± 8 μm |
| Nickel-Layer Thickness | ≥3 μm |
| Gold-Layer Thickness | ≥0.10 μm |
| Operating Temperature | −50°C to 350°C |
| Electrode Pattern | Interdigitated electrode array |
| Reusability | Reusable after appropriate cleaning, provided that the electrode surface is not damaged |
| Customization | Available upon request |
Typical Applications
- Gas-sensor development
- Humidity-sensor research
- Temperature and thermal sensing
- Pressure-sensitive components
- Photosensitive sensor development
- Biosensor research
- Functional-material coating studies
Cleaning and Handling
The electrode surface may be gently wiped with ethanol. If the
conductive pattern and surface coating remain undamaged, the
electrode can be cleaned and reused.
Hydrochloric acid cleaning may be used when required by the
experiment. However, prolonged use or storage in an acidic
environment is not recommended. Confirm chemical compatibility
with the actual concentration, temperature and exposure time
before use.
Customization Available
Custom alumina ceramic interdigitated electrodes are available.
Please contact our customer service team for detailed information.
Please provide the required substrate dimensions, finger width,
finger gap, finger-pair count, metal-layer requirements and a
technical drawing, if available.
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