Silicon Interdigitated Electrode Array
This interdigitated electrode array is manufactured on a
single-crystal silicon substrate with a thermally grown silicon
dioxide insulating layer. The electrode structure consists of
a 50 nm titanium adhesion layer and a 100 nm gold
conductive layer. Multiple finger-width, finger-gap and
finger-pair configurations are available for MEMS, gas-sensing,
optical-sensing and biosensor research.
Product Specifications
| Product Type | Silicon interdigitated electrode array |
| Substrate Material | Single-crystal silicon |
| Overall Dimensions | 4 × 6 × 0.5 mm |
| Insulating Layer | Thermally grown silicon dioxide (SiO₂) |
| SiO₂ Layer Thickness | 285 nm |
| Metal Structure | Titanium / Gold (Ti/Au) |
| Titanium Layer Thickness | 50 nm |
| Gold Layer Thickness | 100 nm |
| Operating Temperature | −150°C to 500°C |
| Electrode Pattern | Interdigitated electrode array |
Available Models
Select the required finger width, finger gap and number of
interdigitated finger pairs from the configurations below.
| Model | Overall Size | Finger Width | Finger Gap | Finger Pairs | Metal Structure |
|---|---|---|---|---|---|
| SI-IDE-4X6-3W-3G-195P | 4 × 6 × 0.5 mm | 3 μm | 3 μm | 195 pairs | 50 nm Ti / 100 nm Au |
| SI-IDE-4X6-5W-3G-138P | 4 × 6 × 0.5 mm | 5 μm | 3 μm | 138 pairs | 50 nm Ti / 100 nm Au |
| SI-IDE-4X6-5W-5G-119P | 4 × 6 × 0.5 mm | 5 μm | 5 μm | 119 pairs | 50 nm Ti / 100 nm Au |
| SI-IDE-4X6-10W-10G-25P | 4 × 6 × 0.5 mm | 10 μm | 10 μm | 25 pairs | 50 nm Ti / 100 nm Au |
| SI-IDE-4X6-20W-20G-25P | 4 × 6 × 0.5 mm | 20 μm | 20 μm | 25 pairs | 50 nm Ti / 100 nm Au |
| SI-IDE-4X6-30W-30G-25P | 4 × 6 × 0.5 mm | 30 μm | 30 μm | 25 pairs | 50 nm Ti / 100 nm Au |
Typical Applications
- MEMS sensor development
- Gas-sensing research
- Optical and photoelectric sensing
- Biosensor development
- Impedance and capacitive measurements
- Functional-material coating studies
Customization Available
Custom silicon interdigitated electrode configurations are
available. Please contact our customer service team for detailed
information.
When requesting customization, please provide the required chip
dimensions, finger width, finger gap, finger-pair count, metal
structure and technical drawing, if available.








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